Automotive Electronics(Connectivity)
Product application
Automotive Electronics(Connectivity)
Automotive Electronics(Connectivity)
Layer Count: 12L HDI, 3+6+3
Material: EM-370(Z)
Array Size: 116 mm x 117 mm
Board Thk: 1.2mm+/-10%
Min Line Width/Spacing: 0.05mm/0.05mm
Min BGA Pitch: 0.35mm
Surface Finish: ENIG + OSP